CC-Link technology is based on the use of an (ASIC) which handles the complete data link layer and transport layer for reliable communications and assures interoperability between devices.
To aid the development of CC-Link compatible devices and connectivity, the CC-Link Partner Association (CLPA) is offering free chipsets to Regular members who wish to design compatible interfaces.
Each ASIC not only includes the special CC-Link communication chip, but comes complete with all other necessary electronic components needed to interface to it. This unique service from the CLPA will make it even easier for new vendors to connect to CC-Link, as designers do not have to waste valuable time finding other suitable components.
The starter kits are available at present in two types, MFP2, for simple remote devices such as I/O or pneumatic manifolds, and MFP3, which is for more intelligent remote devices such as PLCs, HMIs and variable speed drives.